The future belongs to those who rethink what’s possible. Across life sciences, logistics, smart homes and consumer appliances, the race is on to create products that are not just connected, but truly intelligent, efficient and secure. Achieving this next level of innovation requires bold choices in both technology and design. One solution leading the charge is Chip-on-Board (CoB) technology: a compact, dual-band Wi-Fi solution that redefines how next-generation products are designed and built. By integrating a complete System-on-Chip (SoC) directly onto application-specific printed circuit boards (PcBs), instead of adding connectivity via a plug-in module, this approach enables engineers to design smaller, smarter and more adaptable products without compromising performance.
Unlocking performance and flexibility through embedded design
Innovation thrives when technology becomes invisible, when performance, security and connectivity work seamlessly in the background. Unlike pre-assembled modules, CoB platforms – such as NXP’s – brings all key hardware and software components together in a single, secure chip – combining dual-band Wi-Fi (2.4 GHz & 5 GHz), Bluetooth Low Energy (BLE) and open-standard protocols, ready to be mounted directly onto a customized PCB.
This embedded approach goes beyond saving space. It provides complete control over critical design elements such as RF performance, security architecture, thermal management, memory capacity and physical interfaces. Product teams can fine-tune devices to meet specific requirements, ensuring strong connectivity, reliability and energy efficiency across a wide range of applications – from wearable medical devices to smart home appliances or industrial sensors.
Innovation without compromise: Cost, security and speed
CoB designs deliver more than performance. By embedding the chip directly onto the PCB rather than relying on pre-assembled modules, developers can reduce costs and enhance security while gaining greater control over configuration, firmware and supply chain management. Although this approach may require more design-in effort than using a pre-certified module, it offers far more flexibility in placement, performance tuning and I/O access—ensuring the full potential of the SoC can be leveraged. At Verhaert, we apply this method in projects such as our collaboration with Newell, where custom SoC integration has proven to deliver tangible benefits in both cost efficiency and security. Devices become harder to hack, easier to update and ready for global deployment.
This approach also opens new business opportunities. Companies can explore connected-product-as-a-service models that keep devices intelligent and adaptable long after they leave the factory. From smart plugs to connected appliances, the possibilities for differentiation are endless.
The future of product innovation is embedded
We stand at the edge of a new frontier, where connected products are more than just tools – they’re experiences. Embedded solutions like NXP’s Chip-on-Board represent a shift toward products that are smaller, smarter, secure, scalable, cost-effective and sustainable.
With strong embedded solutions, innovation teams gain the freedom to move faster, think bigger and create products that not only meet today’s needs but help shape the future. The principle is simple: smarter products start with smarter design. If you’re exploring how to bring such possibilities to life, now is the time to start the conversation.